An introduction to CPO technology

      1. What is CPO?
      CPO, Co-packaged optics (CPO) is the co-packaging of chips and modules by assembling the switching chip and the optical engine in the same socketed slot.

Figure 1 CPO Co-Packaging

      The current packaging technology is a separate chip package, and then connected to the optical module, so it is called an integrated circuit, the future application of CPO technology can be called integrated "light" road.
      2. CPO co-encapsulation evolution
      The current packaging technology is divided into three types: Pluggable is the basic stage, NPO is the transition stage, CPO is the ultimate form !
      Pluggable, a traditional connection. Optical engine is a pluggable optical module, optical fiber over, inserted in the optical module, and then through the SerDes channel, to the network switching chip (AISC).
      NPO, known as Near packaged optics (NPO), is to separate the optical engine from the switching chip and assemble them on the same PCB substrate.
      CPO, the switching chip and optical engine are assembled together on the same socketed, forming a co-package of chip and module.

Figure 2 CPO co-packaging evolution

      3. Advantages of CPO technology
      Low latency and low power consumption: Since the optical module and switching chip are in the same package, the signal transmission path is shorter and lower latency can be realized. In addition, optoelectronic co-packaging technology can reduce the power consumption of signal transmission and improve the overall system energy efficiency.
      High bandwidth: Optical co-packaging technology supports high-speed optical communications, providing greater bandwidth for data transmission. Many mega and cloud data centers are expected to adopt 100G server port speeds in the coming years. Higher server speeds (e.g., 800G, 1.6T) are constantly being developed and applied, also expanding the application of CPO.
      Small size: Compared with the traditional optical module and electronic chip separate packaging, optoelectronic co-packaging technology can realize more compact size, which is conducive to the application of high-density integrated circuits.
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